Rework, Modification and Repair of Electronic Assemblies
Papier (300 pagini )
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Electronic component assemblies
This guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures. Color illustrations are included in many procedures. Over 300 pages. Released January 2017.